Smartphones have almost become an essential part of our lives, with everyone from 80-year-old seniors to 1-year-old toddlers   immersed in the world of phones. Beyond factors like specifications and price, the quality of a smartphone is one of the main concerns for consumers. Since phones are handled every day, “drop resistance” is a quality feature that consumers value highly.

In the past,Nokia feature phones left a deep impression for their almost indestructible build. Although jokes circulated that they could crack walnuts or hammer nails, behind the humor was genuine admiration for their reliability. In recent years, smartphones have also shown impressive drop resistance, and the secret behind this durability has entered public awareness—dispensing (glue application).   Manufacturers apply precise dispensing to key components of smartphones to enhance their structural integrity…

Whether and how well dispensing (glue application) is applied to components greatly determines the robustness and reliability of a smart phone.

If you take apart and analyze smartphones from many well-   known   manufacturers, you will find   that the vast majority   use   dispensing   for   protection. Typically, manufacturers apply high-strength   glue to AP chips and memory   chips to ensure that these components   are not easily damaged if the phone is dropped. “As chip pin density increases and chip size grows, dispensing has gradually become a crucial process for protecting circuit boards. Under similar manufacturing conditions, proper dispensing can significantly improve product reliability and lifespan.”

Why does dispensing provide protection?

Dispensing protects chip solder balls or component solder joints, preventing functional failures caused by cracking from drops, compression, or bending. It also offers waterproofing, light-blocking, sealing, and other protective functions.

1. Prevents solder ball detachment or joint fractures caused by thermal stress between the circuit board chips and the substrate.

2. Protects chips and solder joints from damage due to drops or vibrations.

3. Prevents functional failures caused by uneven stress distribution leading to solder ball cracking.

4. Overall encapsulation provides waterproofing and shock resistance.

5. Gap filling and sealing for water protection (e.g., around cameras).

6. Adhesion and sealing replace many screws or tapes, improving both functionality and product aesthetics.

   

With the rapid development of technology, consumers demand increasingly diverse and innovative electronic products. Consequently, the trend in electronic product manufacturing is driving higher standards and expectations for dispensing processes.

By using dispensing machines to apply glue to components, products receive better protection, and their overall quality and reliability are significantly enhanced.